| 摘要 |
PROBLEM TO BE SOLVED: To enhance the quality of a developing process while protecting a substrate being processed. SOLUTION: A developer supply nozzle 70 has ejection openings 80(1), 80(2),..., 80(n) arranged in a direction not horizontal to a horizontal nozzle arm 76 but inclining slightly. At the time of development, the horizontal nozzle arm 76 moves in a horizontal direction (shown by an arrow F) perpendicular to the axial direction thereof to carry the developer nozzle 70 from a nozzle waiting part 78 to the upper set position of a semiconductor wafer W. During movement to the set position, the developer supply nozzle 70 scans the semiconductor wafer W ejecting developer in stabilized jet flow from each ejection opening 80(1), 80(2),..., 80(n). |
