发明名称 DEVICE AND METHOD FOR FORMING ELECTRODE OF ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide an electrode formation device that can satisfactorily and stably form an electrode in a chip. SOLUTION: Three working processes 1, 2, and 3 are carried out. In the working process 1, a movable carrier tape 1 and a fixing base plate 2 are used, the carrier plate 1 is moved on the base plate 2, and at the same time the chip C1 is thrown into a hole 1a of the carrier tape 1. In this case, the number of holes 1a for receiving the chip C1 in a specific posture are formed in the movable carrier tape 1, and the lower-surface side of the carrier tape 1 is covered for blocking the lower-end opening of the hole 1a, and the lower end of the chip C1 thrown into the hole 1a of the carrier tape 1 is supported while the lower end can be slid by the fixing type base plate 2. In the working process 2, conductive paste CP is applied to the projection of the chip 1 that exists in the hole 1a of the carrier tape 1, and at the same time is supported by the base plate 2. In the working process 3, the applied paste CP is dried.</p>
申请公布号 JP2002124442(A) 申请公布日期 2002.04.26
申请号 JP20000318216 申请日期 2000.10.18
申请人 TAIYO YUDEN CO LTD 发明人 SUGITA SHINICHI;SUGAI KAZUO
分类号 H01C17/28;H01F27/29;H01G13/00;(IPC1-7):H01G13/00 主分类号 H01C17/28
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