发明名称 METHOD AND DEVICE FOR FORMING EXTERNAL ELECTRODE OF ELECTRONIC COMPONENT AND CARRIER TAPE
摘要 <p>PROBLEM TO BE SOLVED: To provide a formation method and device of the external electrode of electronic components, which can accurately apply conductive paste onto the outer surface of a chip, and to provide a carrier tape useful when the conductor paste for the external electrode is applied to the chip. SOLUTION: This carrier tape 10 is used. In this case, the carrier tape 10 has an elastic body 12 where a retention hole 15 for retaining the chip inside is formed, and a reinforcing member 16 provided around the retention hole 15, thus preventing the elastic body 12 from being folded up even if the chip is moved in the thickness direction of the carrier tape 10, stably retaining the chip, and at the same time accurately applying the conductive paste.</p>
申请公布号 JP2002124441(A) 申请公布日期 2002.04.26
申请号 JP20000318203 申请日期 2000.10.18
申请人 TAIYO YUDEN CO LTD 发明人 MATSUSHITA HARUHIKO;SUGAI KAZUO
分类号 H01G13/00;(IPC1-7):H01G13/00 主分类号 H01G13/00
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