| 摘要 |
PROBLEM TO BE SOLVED: To eliminate mask processing on a portion, other than a soldered portion by making a lead frame in a shape, in which solder is not attached to the portion other than the soldered portion, when a chip component is soldered on the lead frame. SOLUTION: Since a leveled wall 1b is formed on a soldered portion 1A of a chip component 2 on a lead frame 1 by providing a leveled portion 1a, a molten solder 3 is blocked by the leveled wall 1b and thereby will not flow out to a portion 1c other than the soldered portion of the lead frame 1, upon soldering. Consequently, a more inexpensive lead frame can be provided by abolishing mask processing, where the portion 1c other than the soldered portion is coated and covered with a resist 12.
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