| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for sealing and forming semiconductor devices without deformation or warpage and without including air bubbles inside. SOLUTION: The method for sealing semiconductor devices is provided with a step of fitting a base plate on the bottom face of a substrate for mounting multiple devices; a step of forming a weir of elastic material surrounding the substrate on the base plate; a step of injecting liquid resin for sealing inside the weir for burying the devices in the resin; a step of covering the liquid surface of the injected resin with a top plate, and pressurizing the weir for elastic deformation for making the excessive resin overflow; a step of integrally fixing the top plate, the substrate, the weir and the base plate, reversing the whole and curing the resin; a step of separating the top plate, the substrate, the weir and the base plate after curing; and a step of dividing the substrate into individual devices after separating. In this case, the height of the part of the weir where the resin is made to overflow is set lower than its other part.
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