发明名称 HEAT SINK
摘要 PROBLEM TO BE SOLVED: To provide a heat sink, having pin-shaped heat dissipation pins which can be miniaturized and on which pins can be fixed easily and reliably. SOLUTION: The heat sink is provided with a board 18, made of a metal or other material having a high thermal conductivity and a plurality of metal pin-shaped heat dissipation fins 12 which are erected on the surface thereof. Each fin 12 is consists of a body 14 whose cross section is columnar or of another shape, a flange part 16 formed, so as to encircle the side circumference of the one end of the body 14, and a mounting face 17 which is the end face of the flange part 16. The mounting part 17 of the each fin 12 is abutted and fixed on the surface of the substrate 18.
申请公布号 JP2002124610(A) 申请公布日期 2002.04.26
申请号 JP20000318294 申请日期 2000.10.18
申请人 FINECS KK;FURUKAWA SANGYO KAISHA LTD 发明人 MATSUDA NOBORU;YOSHIDA KAZUO
分类号 H05K7/20;H01L23/36;(IPC1-7):H01L23/36 主分类号 H05K7/20
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