ADHESIVES AND ADHESIVE FILM

摘要

PROBLEM TO BE SOLVED: To provide a conductive adhesives which can surely connect a semiconductor element to a flexible printed board without short-circuiting. SOLUTION: Conductive particles 25 with an average diameter ranging between 10 nm or more and 90 nm or less are added to the conductive adhesives. When jointing a flexible circuit board 10 and a semiconductor element with those adhesives, as the conductive particles do not break through a protection film 37 of the semiconductor element 30, a signal part 35b of a wiring film 35 under the protection film 37 is protected, and wiring films 15, 35 of an obtained electric device do not short-circuit each other.