| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit board having advantages capable of uniforming thickness of plating, accurately flip-chip connecting semiconductor chip, and the like. SOLUTION: Silver plating membrane are formed all over copper patterns 36, 38, and 39 formed on surface of a substrate 32. Silver plating membrane on certain patterns 38 and 39 out of the patterns are exposed. Ni-Au plating membrane, Ni-Pd-Au plating membrane, Ni-Pd plating membrane, or Pd-plating membrane is formed on the silver membrane on the other pattern 38.</p> |
