发明名称 LAMINATE AND MULTILAYERED WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a laminate which is suitable for producing a multilayered printed wiring board capable of being simultaneously bored by a carbon dioxide gas laser drilling device, and having high heat resistance, narrow pitch wiring pattern, small diameter via, uniform insulating layer thickness and suitably low linear expansion coefficient. SOLUTION: In the laminate having a conductor layer on at least one side of a polyimide film and having an adhesive layer on the other side, the conductor layer, the polyimide film and the adhesive layer, which can be bored by a carbon dioxide gas laser, are to be used.</p>
申请公布号 JP2002124751(A) 申请公布日期 2002.04.26
申请号 JP20000316354 申请日期 2000.10.17
申请人 KANEGAFUCHI CHEM IND CO LTD 发明人 ITO TAKU;NISHINAKA MASARU;SHIMOOOSAKO KANJI
分类号 B23K26/00;B23K26/38;B32B15/08;B32B15/088;C08J5/18;H05K3/00;H05K3/46;(IPC1-7):H05K3/00 主分类号 B23K26/00
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