Production of a capacitor used in the semiconductor industry comprises mechanically treating the rear side of a semiconductor die to remove a section of substrate, fixing the die to a mounting device, and chemically treating the die

摘要

Production of a capacitor comprises mechanically treating the rear side (50) of a semiconductor die to remove a first section (31) of substrate (30); fixing the treated die to a mounting device; and chemically treating the die to remove a second section (32) of substrate and expose a capacitor with deep trenches. An Independent claim is also included for a process for investigating the structure of a capacitor. Preferred Features: The first section of substrate is a layer having a thickness of 20-100, preferably 60 mu m. The mechanical treatment is carried out by polishing for 30 minutes. The die is fixed to the mounting device using an epoxy resin adhesive.