发明名称 METHOD FOR PLATING TILES WITH PRECIOUS METALS BY MELTING
摘要 PURPOSE: Provided is a method for plating tiles with precious metals(Au, Ag, Pt, etc.) by sintering metal-coated tiles, which enables pure metal-plating and saves the amount of metals used so that it saves manufacturing cost. CONSTITUTION: The plating method comprises the steps of: preparing a precious metal(Au, Ag, Pt, etc.) solution by mixing 45.6-64.52wt.% of metal powder, 12.9-23.26wt.% of water, 9.68-6.98wt.% of low temperature flux, frit, 12.9-23.26 wt.% of screen oil; coating the surface of tile with prepared metal solution; preheating at 100-600deg.C for 30-45min to prevent tile cracking, evaporate screen oil, and melt flux; sintering at 800-1000deg.C for 20-30min for metal coating; cooling at 250-750deg.C for 30-45min.; and optionally polishing for Ag-plated tiles, and coating with anti-abrasives(0.01-0.02mm thickness) and sintering at 700-900deg.C for 20-30min. for Au- and Pt-plated tiles. The anti-abrasives comprise 55-70wt.% of glass powder, 20-30wt.% of screen oil, 10-15wt.% of water.
申请公布号 KR20020030775(A) 申请公布日期 2002.04.25
申请号 KR20020020130 申请日期 2002.04.12
申请人 SHIN, HONG DAI 发明人 SHIN, HONG DAI
分类号 C04B41/51;C04B41/88;(IPC1-7):C04B41/51 主分类号 C04B41/51
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