METHOD FOR INSPECTING SLIP LINE OF WAFER

摘要

PURPOSE: A method for inspecting a slip line of a wafer is provided to accurately decide a cause of the slip line and to determine whether the slip line is generated, by determining seven items regarding the cause of the slip line and by synthetically overestimating the items. CONSTITUTION: A crystal structure of the wafer is transformed in the slip line. Whether the slip line is generated by oxygen deposited in a predetermined portion of the wafer during a unit process using the wafer, is determined. Whether the slip line is generated by a planarization degree of the surface of the wafer is determined. Whether the slip line is generated by the position of each fabricating apparatus wherein the respective wafers are transferred, is determined. Whether the slip line is generated by each apparatus for performing a unit process using the wafer is determined. Whether the slip line is generated by the temperature at which the wafer is heated during a unit process using the wafer is determined. Whether the slip line is generated by a crystal growth type of the wafer is determined. Whether the slip line is generated by different vendors of the wafer is determined.