| 摘要 |
<p>A heat shrinkable multilayer cook-in film for packaging food products including a heat sealable layer and a heat shrink layer each modified by blending with an adhesive resin selected to adhere to said heat sealable layer; a thermoplastic oxygen barrier layer adjacent said heat shrink layer, said heat shrink layer being further modified by blending with an adhesive resin selected to be adherent to said oxygen barrier layer, and an abuse layer adjacent said oxygen barrier layer and comprising a polymer blend including an adhesive resin selected to be adherent to said oxygen barrier layer. Advantageous the films of the invention do not require discrete adhesion layers to achieve acceptable layer adhesion when exposed to pasteurization and cooking temperatures.</p> |
