| 发明名称 |
METALLIC UNDERCOATING FOR SOLDER MATERIALS |
| 摘要 |
A semiconductor substrate has an underbump metallization for solder materials. The semiconductor substrate has applied thereto a titanium layer serving as a diffusion barrier and as a wettable surface for the solder-material bump. The solder-material bump is adapted to be applied directly to said diffusion barrier.
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| 申请公布号 |
US2002047217(A1) |
申请公布日期 |
2002.04.25 |
| 申请号 |
US19990325494 |
申请日期 |
1999.05.28 |
| 申请人 |
ZAKEL ELKE;KALLMAYER CHRISTINE;NAVE JENS |
发明人 |
ZAKEL ELKE;KALLMAYER CHRISTINE;NAVE JENS |
| 分类号 |
B23K35/00;(IPC1-7):H01L23/48 |
主分类号 |
B23K35/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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