| 摘要 |
PURPOSE: A band clip device for a plate spring is provided to modify the mounting of buffering pads to be interposed between a plurality of plate element layers which form a plate spring, thereby compensating the abrasion of the buffering pads and reducing the noise generation due to the friction between the plate elements. CONSTITUTION: A band clip device for a plate spring includes a band clip(14) applying a restraining force to plate elements(12) stacked inside in the shape of a plurality of bands of different length, wherein both opposing parts(14a) of the band clip are formed with a plurality of mounting holes) to be inserted by flexible buffering pads(20) of which ends are positioned between the plate elements.
|
