MOLD BLOCK FOR FABRICATING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A mold block for fabricating a semiconductor package is provided to reduce the quantity of cull filled in a space of a center block and to save molding resin, by reducing the space of the center block of the mold block. CONSTITUTION: The center block(20) is connected to a port for supplying resin. A runner(12) is connected to both sides of the center block. A plurality of cavities(14) are connected to the runner. The concave space of the center block connected to port for supplying resin is reduced. The central portion of the center block protrudes to the upper surface of the mold block(10).