| 摘要 |
It is intended to provide an optical device having superior frequency characteristics and high optical axis stability. The back surfaces of an optical modulator and a pair of transmission lines are bonded to a pedestal in such a manner that the transmission lines are located on both sides of the optical modulator. Conductive bumps are formed on the transmission lines and electrode pads that are formed on the front surface of the optical modulator. A connection transmission line is bonded to the bumps, whereby the electrode pads of the optical modulator are connected to the transmission lines via the connection transmission line.
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