发明名称 METHOD AND DEVICE FOR FORMING OUTER PACKAGE BODY OF PRODUCT
摘要 A method of forming the outer package body of a product, comprising the steps of disposing, in a metal mold, a semi-finished product (50) formed of a plurality of components assembled integral with each other and filling a molten resin into the metal mold to cover ,with resin, the peripheral areas of the semi-finished product (50) with the opening parts (34, 35, 36) provided in the semi-finished product (50) at the portions in correspondence with a positive terminal (4), a negative terminal (5), and a temperature detection terminal (6) of the semi-finished product (50), or cover, with resin, the semi-finished product (50) by filling the resin into opening ends provided in outer package cases (51) to (54) to allow the semi-finished product (50) to be inserted therein after the semi-finished product (50) is stored in the outer package cases (51) to (54), whereby the outer package body of the product of thin closed structure can be formed with small size and excellent dustproofness and dripproofness.
申请公布号 WO0233766(A1) 申请公布日期 2002.04.25
申请号 WO2001JP09226 申请日期 2001.10.19
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;IWAIZONO, YOSHINORI;KONISHI, SHOJI;ISHIMARU, TAKESHI 发明人 IWAIZONO, YOSHINORI;KONISHI, SHOJI;ISHIMARU, TAKESHI
分类号 B29C45/14;B29C45/27;B29C70/72;B29C70/88;H01M2/00;H01M2/02;H01M2/08;H01M2/16;H01M10/052;H05K5/00;(IPC1-7):H01M2/00 主分类号 B29C45/14
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