| 摘要 |
An integrated optical package comprises an integrated optical device in a substantially planar form and a supporting structure, the device being held by the supporting structure in a plurality of fixing regions, the fixing regions being elongate and serving to secure the device in each of the two dimensions of the planar form, at least one edge of the planar form being unfixed. Thus, either two or three edges of the planar form are unfixed, assuming that the device is rectangular. This ensures that one or two edges are free, allowing the device to accommodate stresses by slight relaxation. The device can be held by a heat curable composition, ideally adapted to cure at about the operating temperature of the device. Thus, when the device is operating, the adhesive is substantially at or near its cure temperature. The composition should cure at a temperature within 20° C. of the operating temperature of the device. Given the normal operating temperatures of AWG devices, suitable cure temperatures are between 60 and 90° C., more preferably between 70 and 80° C. or 70 to 75° C. The composition is preferably resilient after curing to assist further in reducing stresses in the device. The application also relates to an integrated optical package comprising an integrated optical device in a substantially planar form, a supporting structure, controlled heating apparatus to elevate the temperature of the device to within a selected temperature range, the device being attached to the supporting structure by a curable composition with a curing temperature within about 20° C. of the selected temperature range.
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