Production of an integrated component comprises preparing an integrated circuit with contact pads connected to electrically conducting humps, applying the circuit onto a substrate

摘要

Production of a component comprises preparing an integrated circuit (1) having an active main side (5) with contact pads (11) connected to electrically conducting humps (2); applying the circuit onto a substrate, the main side of the circuit facing the substrate; enclosing the circuit using a cast mass (3); and removing parts of the substrate from the circuit. Preferred Features: The step of applying the circuit to the substrate comprises connecting the humps to the substrate by thermal compressing or alloying. The substrate is removed by etching, delaminating, grinding or sawing.