发明名称 |
PROCESS FOR MAKING SEMICONDUCTOR CHIP ASSEMBLY |
摘要 |
A semiconductor chip carrier assembly which includes a flexible substrate having a metallicized path on one of its surfaces in electrical communication with a semiconductor chip. A stiffener is disposed adjacent to said flexible substrate and is bonded thereto by an adhesive composition. The adhesive composition which comprises a microporous film laden with a curable adhesive is disposed between the flexible substrate and the stiffener. A cover plate is adhesively bonded to the semiconductor chip and to the stiffener. A process of making the assembly involving disposition of the flexible substrate in a vacuum fixture upon which the adhesive composition and stiffener is placed followed by the application of heat and pressure to cure the curable adhesive is also described.
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申请公布号 |
US2002046804(A1) |
申请公布日期 |
2002.04.25 |
申请号 |
US19990397739 |
申请日期 |
1999.09.16 |
申请人 |
CULNANE THOMAS M.;GAYNES MICHAEL A.;KODNANI RAMESH R.;PIERSON MARK V.;WOYCHIK CHARLES G. |
发明人 |
CULNANE THOMAS M.;GAYNES MICHAEL A.;KODNANI RAMESH R.;PIERSON MARK V.;WOYCHIK CHARLES G. |
分类号 |
H01L21/60;H01L23/12;H01L23/495;(IPC1-7):B29C65/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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