| 摘要 |
<p>PURPOSE: A lead frame structure for fabricating a semiconductor package is provided to prevent a package defect caused by a remaining gate flash, by completely eliminating the gate flash in a deculling process performed after a molding process. CONSTITUTION: A semiconductor chip is settled in a die pad. Inner leads(3) are disposed near the die pad. Outer leads(4) extend to the opposite side of the inner leads, corresponding to the inner leads. A dam bar(5) is positioned between the inner leads and the outer leads. A guide rail unit supports the abovementioned constitution elements. The die pad is connected to a frame body to support a tie bar(6).</p> |
