| 摘要 |
<p>A coupling (10) such as a socket may couple one electronic device to another and may reduce differential thermal expansion between the two coupled devices. For example, a surface mount socket (10) may differentially expand relative to a printed circuit board (20). By incorporating a structure having a coefficient of thermal expansion that matches the coefficient of thermal expansion of the printed circuit board, differential thermal expansion may be lessened and the possibility of mechanical damage may be reduced.</p> |
