<p>Disclosed are electroplating baths for enhancing copper seed layers and for subsequent metallization on the seed layers. Methods of enhancing copper seed layers and depositing metal on such seed layers are also disclosed.</p>
申请公布号
EP1199384(A2)
申请公布日期
2002.04.24
申请号
EP20010308872
申请日期
2001.10.19
申请人
SHIPLEY CO. L.L.C.
发明人
MERRICKS, DAVID;MORRISSEY, DENIS;BAYES, MARTIN W.;LEFEBVRE, MARK;SHELNUT, JAMES G.;STORJOHANN, DONALD E.
