| 摘要 |
PURPOSE: An electrical connection is provided to obtain contact pads on microelectronic devices in order to burn-in the devices before they are diced into separate chips. CONSTITUTION: The connector includes a probes, each of which has a tip(81) projecting above a thin elongated spring(83). The spring is supported above a substrate(89) by posts(85) such that the probe tip is free to move vertically in response to a contact force on the probe tip. Deflection of the probe tip is compliantly limited by bending and stretching of the thin spring. Mechanical compliance of the tip allows arrays of the probe to contact pads on integrated circuits where the pads are not precisely planar.
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