| 发明名称 |
Surface metallization structure for multiple chip test and burn-in |
| 摘要 |
A cost-effective surface metallization structure of a TCA carrier is produced by using a high-grit conducting paste to fill TSM vias in the TSM of the TCA carrier. This concept can be applied to alumina substrates with refractory metal conductors or to LCGC substrates with more noble metal conductors.
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| 申请公布号 |
US6376054(B1) |
申请公布日期 |
2002.04.23 |
| 申请号 |
US19990249985 |
申请日期 |
1999.02.10 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LANGENTHAL SCOTT I.;LOMBARDI THOMAS E.;INDYK RICHARD FRANCIS;KNICKERBOCKER JOHN ULRICH;REDDY SRINIVASA S. N.;SHELLEMAN RICHARD A.;VALLABHANENI RAO V.;WALL DONALD RENE |
| 分类号 |
G01R1/04;(IPC1-7):B32B3/00 |
主分类号 |
G01R1/04 |
| 代理机构 |
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