发明名称 |
Polishing head for wafer, and method for polishing |
摘要 |
A polishing head (200) for a chemical-mechanical polishing machine that holds a semiconductor wafer (150) against a polishing pad (140) has a chuck (295) with a pressure chamber (210) to apply a down force substantially equally to the wafer backside (152). An electrode arrangement (270) within the chamber (210) is located coplanar to the wafer (150) to provide compensation to wafer or chuck irregularities by applying a compensation force having a distribution corresponding to the irregularities. |
申请公布号 |
US6375549(B1) |
申请公布日期 |
2002.04.23 |
申请号 |
US20000527859 |
申请日期 |
2000.03.17 |
申请人 |
MOTOROLA, INC. |
发明人 |
GLASHAUSER WALTER;TEICHGRAEBER LUTZ;HAGGART DAVID;EBNER KATRIN |
分类号 |
B24B37/00;B24B37/04;B24B41/06;B24B49/16;H01L21/304;H01L21/683;(IPC1-7):B24B1/00;B23B31/28 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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