| 摘要 |
A chemical-mechanical polishing apparatus for polishing a first side of a semiconductor wafer includes a polishing platen having a polishing surface. The apparatus also includes a wafer carrier assembly having a carrier body. The wafer carrier assembly is adapted to (i) engage the wafer by a second side of the wafer, and (ii) apply pressure to the wafer in order to press the wafer against the polishing surface of the polishing platen. The wafer carrier assembly is operable in a first carrier configuration and a second carrier configuration. A first fixture which is configured to apply pressure to the wafer at a first number of predetermined locations is secured to the carrier body when the wafer carrier assembly is operated in the first carrier configuration. A second fixture which is configured to apply pressure to the wafer at a second number of predetermined locations which are different than the first number of predetermined locations is secured to the carrier body when the wafer carrier assembly is operated in the second carrier configuration. A method of operating a chemical-mechanical polishing system is also disclosed.
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