Planarizing solutions, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies

摘要

Microelectronic substrate assemblies are planarized using methods, planarizing solutions and planarizing machines according to various embodiments of the present invention. A substrate is assembly pressed against a planarizing surface of a fixed-abrasive polishing pad, covering an operative portion of the planarizing surface with a non-abrasive planarizing solution, and moving the substrate assembly and/or the polishing pad with respect to the other. The fixed-abrasive polishing pad includes a body having a suspension medium and abrasive particles fixedly attached to the suspension medium at the planarizing surface. The substrate assembly is a stop-on-feature device including a substrate, a polish-stop layer formed over the substrate to conform to a topography of features on the substrate, and a cover layer formed over the polish-stop layer. The planarizing solution includes a mechanical selectivity agent that increases the mechanical removal rate of the cover layer and/or reduces the mechanical removal rate of the polish-stop layer compared to planarizing solutions without the mechanical selectivity agent.