| 摘要 |
PROBLEM TO BE SOLVED: To facilitate mounting of a radiating board by unifying overall thickness and miniaturize and thin a semi-conductor chip by avoiding excessive resin sealing when carrying out prescribed working treatment by rearranging a plural number of the semi-conductor chips fractionalized and different in thickness on a pseud substrate. SOLUTION: This unifying method of thickness of the fractionalized semi-conductor chips is to unify thickness of the semi-conductor chips by back-grinding these semi-conductor chips with dummy chips by fixing a plural number of the semi-conductor chips fractionalized and different in thickness on the pseud substrate by arranging them in an aligning state and arranging and fixing the dummy chips as thick as or thicker than the semi-conductor chips in a periphery of these arranged semi-conductor chips, thickness of the semi-conductor chips polished in a state surrounded by the dummy chips comes to be roughly the same thickness, consequently, it becomes possible to mount the radiating board and it is possible to eliminate the excessive resin sealing as the whole can be thinned with uniform thickness.
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