发明名称 Passivation capping layer for ohmic contact in II-VI semiconductor light transducing device
摘要 A II-VI semiconductor device includes a stack of semiconductor layers. An ohmic contact is provided that electrically couples to the stack. The ohmic contact has an oxidation rate when exposed to an oxidizing substance. A passivation capping layer overlies the ohmic contact and has an oxidation rate that is less than the oxidation rate of the ohmic contact.
申请公布号 US6376273(B2) 申请公布日期 2002.04.23
申请号 US19980093588 申请日期 1998.06.08
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 CHIEN FEN-REN;HAASE MICHAEL A.;MILLER THOMAS J.
分类号 H01L31/02;H01L33/28;H01L33/40;H01L33/44;H01S5/028;H01S5/042;H01S5/347;(IPC1-7):H01L21/00;H01L21/28;H01L21/320 主分类号 H01L31/02
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