| 发明名称 |
Laser cutting of semiconductor materials |
| 摘要 |
A method of cutting thin bodies of silicon so as to minimize edge damage comprises traversing said bodies with the beam of a pulsed laser in a vacuum or in the presence of forming gas or a noble gas.
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| 申请公布号 |
US6376797(B1) |
申请公布日期 |
2002.04.23 |
| 申请号 |
US20000626708 |
申请日期 |
2000.07.26 |
| 申请人 |
ASE AMERICAS, INC. |
发明人 |
PIWCZYK BERNHARD P.;KALEJS JURIS P. |
| 分类号 |
B23K26/00;B23K26/12;B23K26/40;B23K101/40;H01L21/304;H01L21/3065;(IPC1-7):B23K26/38 |
主分类号 |
B23K26/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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