发明名称 High density, miniaturized arrays and methods of manufacturing same
摘要 High-density, miniaturized arrays including high surface areas. Arrays described include substrate with a coating of linking agents, as well as arrays with reactants affixed to the substrates. Methods of manufacturing high-density arrays of reactants. The methods include the use of oriented, heat shrink films and elastomeric materials. Methods of functionalizing a substrate with linking agents for subsequent affixation of reactants are also disclosed herein.
申请公布号 US6376619(B1) 申请公布日期 2002.04.23
申请号 US19990287379 申请日期 1999.04.07
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 HALVERSON KURT J.;PATIL SANJAY L.;RASMUSSEN JERALD K.
分类号 G01N33/53;B01J19/00;C12M1/00;C12N15/09;C12Q1/68;C40B40/06;G01N33/543;G01N37/00;(IPC1-7):C08F8/30 主分类号 G01N33/53
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