发明名称 Electric circuit apparatus
摘要 Circuit elements of surface-mounting type such as MOSFETs etc. are mounted on a circuit board by soldering. The circuit board is retained slantingly by a base so that any one of the MOSFET falls out by its self-weight when the solder melts due to an abnormal heat generation of the MOSFET. The falling of the MOSFET is stopped by a stopper member, and then the MOSFET becomes in an electrically open state and retained at the stopped position in consequence of the subsequent cooling of the solder. Accordingly, even if one or more of the MOSFETs cause the abnormal heat generation, the continuous heat generation of the MOSFET is stopped and also the other circuit elements are prevented from being short-circuited.
申请公布号 US6377468(B1) 申请公布日期 2002.04.23
申请号 US20000593862 申请日期 2000.06.15
申请人 ANDEN CO., LTD.;DENSO CORPORATION 发明人 OHTANI HIDEYUKI;ISHIKAWA FUKUO;KABUNE HIDEKI;HATTORI HIROSHI
分类号 H05K1/18;H05K1/02;H05K1/14;H05K3/34;(IPC1-7):H05K7/02 主分类号 H05K1/18
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