| 摘要 |
An apparatus and related method for preventing leakage of process gases or liquids from a semiconductor wafer processing system, such as an oxidizing furnace. A specific embodiment of the present invention provides a method of preventing leakage of process gases or liquids from a joint of external piping and piping in a semiconductor wafer processing system. The method includes installing as the external piping a tube. The tube has a flange shaped to accommodate an O-ring. The method also includes providing an O-ring for use with the flange, and fastening the O-ring between the flange and the piping with a fastening mechanism to prevent leakage of process gases or liquids from the joint. Yet another embodiment provides a retrofit to existing external piping. A further embodiment provides an apparatus for processing semiconductor substrates that includes use of the O-ring, fastening mechanism and tube with flange.
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