| 摘要 |
A method for manufacturing a smart card in which a through-passage is produced in a central sheet. At least one face of the central sheet is provided with at least one metal coil having connection parts, and an electronic chip having electrical connection pads is inserted into the passage. At least some of the electrical connection pads of the chip are soldered to the connection parts of the coil, and the faces of the central sheet are provided with external covering sheets to form a stack of sheets. In a preferred method, the stack of sheets is hot pressed or laminated such that the material of the sheets is flowed and fills the space around the chip. A smart card is also provided. The smart card includes at least one metal coil having at least two connection parts, an electronic chip connected to the connection parts of the coil, a central sheet having a through-passage, and external covering sheets that grip the central sheet. The electronic chip is placed in the passage in the central sheet. In one preferred embodiment, the central sheet and the covering sheets form a single entity in which the chip and the coil are completely embedded.
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