| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has little warpage after molding, during ball soldering and after a soldering treatment such as a reflow treatment for sealing an area-packaging semiconductor device, particularly the one which has a high ratio of the area occupied with a semiconductor element. SOLUTION: In an epoxy resin composition for sealing a semiconductor using an epoxy resin, a phenol resin, a curable accelerator and an inorganic filler as main components, the epoxy resin composition for sealing a semiconductor has characteristics of a cured substance from thermosetting of the epoxy resin composition which are a <=10R (wherein R is 7-10×(b+c)), 300<=a<=500 and 0.15<=b+c, wherein a (N/mm2) is a flexural modulus at a molding temperature, b (%) is a curing contraction rate and c (%) is a heat contraction rate from a molding temperature to a room temperature.
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