发明名称 Joining material for electronic components electronic components and a method for manufacturing the same
摘要 A joining material for an electronic component is disclosed. The component has a plurality of functional layers, each selected from a magnetic layer and dielectric layer and the functional layers are joined with each other. The joining material is comprises a glass and a composition of a mol % of ZnO, b mol % of BaO and c mol % of TiO2 (a=12-45, b=4-45, c=18-81, a+b+c=100), wherein 0.1 to 10 weight parts of the glass is added to 100 weight parts of the composition.
申请公布号 US6376085(B1) 申请公布日期 2002.04.23
申请号 US19990256856 申请日期 1999.02.24
申请人 NGK INSULATORS, LTD. 发明人 OOBUCHI TAKESHI;KODA YASUNORI
分类号 C03C8/04;C03C8/14;C03C8/24;C04B37/00;C09J1/00;H01G4/30;H01G4/40;(IPC1-7):B32B15/01;H01G4/12 主分类号 C03C8/04
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