| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free solder alloy having the characteristics of high strength, high fatigue resistance and high wettability. SOLUTION: This lead-free solder alloy has a melting temperature lower than 215 deg.C and is substantially composed of 76 to 96% tin, 0.2 to 2.5% copper, 2.5 to 4.5% silver and >0 to 12% indium.
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