| 发明名称 |
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame |
| 摘要 |
A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts.
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| 申请公布号 |
US6376921(B1) |
申请公布日期 |
2002.04.23 |
| 申请号 |
US19980192201 |
申请日期 |
1998.11.16 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
YONEDA YOSHIYUKI;NOMOTO RYUJI;MOTOOKA TOSHIYUKI;TSUJI KAZUTO;KASAI JUNICHI;KAWAHARA TOSHIMI;SAKODA HIDEHARU;ITASAKA KENJI;KAMIFUKUMOTO TERUMI |
| 分类号 |
H01L21/00;H01L21/48;H01L21/56;H01L21/68;H01L21/683;H01L23/31;H01L25/10;H01L29/06;H05K1/18;H05K3/30;H05K3/34;(IPC1-7):H01L23/28 |
主分类号 |
H01L21/00 |
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