发明名称 Method of inspecting a pattern on a substrate
摘要 A method for inspecting a pattern formed on a substrate, includes the steps of moving a table along a first direction on which a substrate to be inspected is mounted, irradiating a converged electron beam on the substrate by scanning the converged electron beam along a second direction which is perpendicular to the first direction; detecting an electron radiated from the substrate by the irradiation of the converged electron beam in which the movement of the table and the scanning of the converged electron beam are synchronized; forming a digital image of the substrate from the detected electron; improving a quality of the digital image by filtering the digital image; and detecting a defect of a pattern formed on the substrate by using the improved quality digital image.
申请公布号 US6376854(B2) 申请公布日期 2002.04.23
申请号 US20010848422 申请日期 2001.05.04
申请人 HITACHI, LTD. 发明人 SHISHIDO CHIE;HIROI TAKASHI;YODA HARUO;WATANABE MASAHIRO;KUNI ASAHIRO;TANAKA MAKI;NINOMIYA TAKANORI;DOI HIDEAKI;MAEDA SHUNJI;NOZOE MARI;SHINODA HIROYUKI;TAKAFUJI ATSUKO;SUGIMOTO ARITOSHI;USAMI YASUTSUGU
分类号 G01N23/20;G01N21/88;G01N21/956;G01N23/225;G06T1/00;H01L21/66;(IPC1-7):G01N21/88 主分类号 G01N23/20
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