发明名称 Method of hard mask patterning
摘要 A method of patterning a hard mask, the comprising the following steps. A semiconductor structure is provided. A conductor film is formed over the semiconductor structure. An oxide layer is formed over the conductor film. A patterned metal oxide layer is formed over the conductor film. The oxide layer and the conductor film are etched, using the metal oxide layer as a hard mask, to form a patterned structure.
申请公布号 US6376379(B1) 申请公布日期 2002.04.23
申请号 US20000495344 申请日期 2000.02.01
申请人 CHARTERED SEMICONDUCTOR MANUFACTURING LTD. 发明人 QUEK SHYUE FONG;ANG TING CHEONG;SONG JUN;LOONG SANG YEE
分类号 H01L21/033;H01L21/311;H01L21/3213;H01L21/768;(IPC1-7):H01L21/302 主分类号 H01L21/033
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