发明名称 |
Stud-cone bump for probe tips used in known good die carriers |
摘要 |
A method of forming a membrane for use in conjunction with a semiconductor carrier and the membrane which includes an electrically insulating substrate and an interconnect pattern formed on the substrate. A stud is coupled to the interconnect pattern over the substrate by forming a gold ball, preferably by gold ball bonding techniques, and coating a portion of the gold ball with a compliant material, preferably an epoxy resin. The coating is filled with a material having sufficient hardness to be capable of penetrating the oxide film on the contact pads of semiconductor devices. The flakes are preferably silver or silver-based.
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申请公布号 |
US6376352(B1) |
申请公布日期 |
2002.04.23 |
申请号 |
US19990431730 |
申请日期 |
1999.11.01 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
ARNOLD RICHARD W.;BEARDAIN WELDON;WILSON LESTER L.;FORSTER JAMES A. |
分类号 |
G01R1/04;H01L21/48;(IPC1-7):H01L21/44 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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