| 发明名称 |
Photosensitive resin and photosensitive resin composition containing the same |
| 摘要 |
The present invention relates to a novel photosensitive resin which can be developed in water and which can be used as a photosensitive resin composition. More specifically, the present invention relates to a composition which is useful as a photosensitive soldering resist for printed circuit board.
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| 申请公布号 |
US6376609(B2) |
申请公布日期 |
2002.04.23 |
| 申请号 |
US20010782256 |
申请日期 |
2001.02.14 |
| 申请人 |
AJINOMOTO CO., INC. |
发明人 |
NAKAMURA SHIGEO;YOKOTA TADAHIKO |
| 分类号 |
C08G59/14;C09D163/10;G03F7/029;G03F7/038;(IPC1-7):G03F7/028;G09D11/10;G09D163/00;C08J3/28;C08L63/00 |
主分类号 |
C08G59/14 |
| 代理机构 |
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