| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a semiconductor functional component, especially an ink jet recording head, at a low cost through a simple process requiring small number of components. SOLUTION: The method for manufacturing a semiconductor functional component, especially an ink jet recording head, comprising a structural body including a semiconductor member having a circumferential surface and a plurality of openings made therein, and a resin member abutting against at least a part of the circumferential surface other than the plurality of openings comprises a step for holding the structural body in a die, a step for filling the die with molten resin and bringing the resin into contact with at least a part of the structural body other than the plurality of openings, and a step for integrating the structural body and the resin by hardening the resin.
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