发明名称 PACKAGING MATERIAL FOR ELECTRONIC-PART CASE
摘要 <p>PURPOSE: A packaging material for electronic-part case is provided, which is excellent in processability and strength, has high aluminum foil/resin layer adhesion, is excellent in water vapor impermeability and heat sealability, and is not attacked by electrolytic solutions, etc. CONSTITUTION: The packaging material comprises a stretched film layer of a heat-resistant resin as an outer-side layer, an unstretched film layer of a thermoplastic resin as an inner-side layer, and an aluminum foil layer disposed therebetween, and is characterized by having an acrylic polymer layer disposed between the aluminum layer and the unstretched film layer.</p>
申请公布号 KR20020029638(A) 申请公布日期 2002.04.19
申请号 KR20010063081 申请日期 2001.10.12
申请人 SHOWA DENKO PACKAGING CO. 发明人 AOYAMA TAKAHIRO;KAWAI HIDEO;NAKAZKI MITSUO;TANAKA KATSUMI
分类号 B32B27/06;B32B15/08;B32B15/082;B32B15/20;H01G9/08;H01M2/02;H01M2/10;(IPC1-7):B32B27/06 主分类号 B32B27/06
代理机构 代理人
主权项
地址