| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in the form of a chip size package which can reliably connect a semiconductor chip and an interposer substrate with a high reliability. SOLUTION: In connection between a semiconductor chip 10 having an electrode 11 and an interposer substrate 12, an anisotropic conductive film 13 wherein resin particles 22 are disposed is disposed between the chip and substrate and heated to form a junction thereof.
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