| 摘要 |
PROBLEM TO BE SOLVED: To obtain basic copper carbonate low C1 and SO4 contents which exert bad influence on plating, when supplying copper ions as basic copper carbonate to a copper plating bath in an electrolytic copper plating treatment. SOLUTION: An aqueous solution of cupric chloride and an aqueous solution containing carbonic ions are mixed to held the pH of the mixed solution in the range of 8.0 to 9.0, further, while the temperature of the mixed solution is held at 75 to 90 deg.C, basic copper carbonate is produced, and, this basic copper carbonate is subjected to solid-liquid separation and is cleaned to control the concentration of chlorine to <=80 ppm. Further, even in the case an aqueous solution of copper sulfate is used instead of an aqueous solution of cupric chloride, the production is performed under the similar reaction conditions to obtain basic copper carbonate in which the concentration of SO4 is <=200 ppm. In the case the reaction temperature is controlled to >=95 deg.C, without performing the control of pH in the mixed solution, e.g. the feeding ratio between the aqueous solution of cupric chloride and carbonic ions is controlled.
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