| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite electronic component, in which a first molded layer and a second molded layer are joined together integrally through the intermediary of an intermediate layer, a joint between the molded layers is high in bonding strength, and the first molded layer and the second molded layer both have superior electrical characteristics. SOLUTION: A dielectric ceramic layer 2, a magnetic ceramic layer 3, and an intermediate layer 4 which contains a glass component and is loaded with inorganic filler are baked into a composite electronic component. When the inorganic filler is baked at a usual burning temperature, the inorganic filler contains material, which is lower in diffusivity and reactivity to the material contained in the layers 2 and 3 than the glass component. More specifically, the inorganic filler contains, for instance, Al2O3, SiO2, ZrO2 and the like, and the glass component contains, for instance, B2O3, SiO2, GeO2, Al2O3, P2O5, V2O5, As2O5, Sb2O5, ZrO2 and the like. |
