发明名称 |
SHOWERHEAD, SUBSTRATE TREATMENT APPARATUS, AND SUBSTRATE MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a showerhead, a substrate treatment apparatus, and a substrate manufacturing method in which high density plasma can be stably generated in a processing chamber. SOLUTION: The showerhead 10 is disposed in the process chamber 2 of a plasma CVD apparatus 1. The showerhead 10 has a plurality of gas introducing holes 11, and the process gas is fed toward a wafer W placed on a pedestal 5 via the gas introducing holes 11. A bead-blasted roughened surface B is formed all over a surface facing the pedestal 5 in the showerhead 10. Thus the area of the surface facing the pedestal 5 in the showerhead 10 is increased, plasma of high density is uniformly generated in the process chamber 2.
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申请公布号 |
JP2002115068(A) |
申请公布日期 |
2002.04.19 |
申请号 |
JP20000310854 |
申请日期 |
2000.10.11 |
申请人 |
APPLIED MATERIALS INC |
发明人 |
TANAKA KEIICHI;YOKOYAMA YASUNORI;SUZUKI TAKASHI;AITANI TERUKAZU |
分类号 |
C23C16/455;C23C16/42;C23C16/44;C23C16/509;C30B25/14;H01L21/28;H01L21/285;(IPC1-7):C23C16/455 |
主分类号 |
C23C16/455 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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