发明名称 SHOWERHEAD, SUBSTRATE TREATMENT APPARATUS, AND SUBSTRATE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a showerhead, a substrate treatment apparatus, and a substrate manufacturing method in which high density plasma can be stably generated in a processing chamber. SOLUTION: The showerhead 10 is disposed in the process chamber 2 of a plasma CVD apparatus 1. The showerhead 10 has a plurality of gas introducing holes 11, and the process gas is fed toward a wafer W placed on a pedestal 5 via the gas introducing holes 11. A bead-blasted roughened surface B is formed all over a surface facing the pedestal 5 in the showerhead 10. Thus the area of the surface facing the pedestal 5 in the showerhead 10 is increased, plasma of high density is uniformly generated in the process chamber 2.
申请公布号 JP2002115068(A) 申请公布日期 2002.04.19
申请号 JP20000310854 申请日期 2000.10.11
申请人 APPLIED MATERIALS INC 发明人 TANAKA KEIICHI;YOKOYAMA YASUNORI;SUZUKI TAKASHI;AITANI TERUKAZU
分类号 C23C16/455;C23C16/42;C23C16/44;C23C16/509;C30B25/14;H01L21/28;H01L21/285;(IPC1-7):C23C16/455 主分类号 C23C16/455
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